Attribute
Description
Manufacturer Part Number
S2711-06R
Manufacturer
Description
RFI SHD FINGR CU TIN SLD 1900/RL
Manufacturer Lead Time
--

Our team will assist you shortly.

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line EZ BoardWare
IC Encapsulation Type Tape & Reel (TR)
Availability Status Obsolete
Device Type Classification Shield Finger
Physical Shape Form -
Horizontal Width Dimension 0.090" (2.28mm)
Linear Length Dimension 0.346" (8.79mm)
Vertical Dimension 0.140" (3.55mm)
Construction Material Type Copper Alloy
Metal Plating Layer Tin
Plating Layer Depth 118.11µin (3.00µm)
Mounting Technique Solder
Ambient Temp Range -40°C ~ 125°C

Description

Fastened using a Solder method for dependable placement. Features a height of 0.140" (3.55mm) for accurate dimensional precision. Overall length 0.346" (8.79mm) for size indication. Type of construction material Copper Alloy for durability and efficiency. Temperature range -40°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR) for safeguarding or transporting components. A metallic layer Tin to enhance conductivity and resist corrosion. The thickness of the plating layer 118.11µin (3.00µm) according to specifications. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component EZ BoardWare. Type classification Shield Finger for specifications. Horizontal width measurement 0.090" (2.28mm).