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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HSP50016 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Primary Function Mode | Downconverter | |
| Oscillation Rate Hz | - | |
| Wireless RF Category | AMPS, CDMA, Cellular, GSM, NA, TDMA | |
| Additional Feature Specs | - | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 44-LCC (J-Lead) | |
| Vendor Package Type | 44-PLCC (16.58x16.58) |
Description
Engineered with Downconverter features for versatile component usage. Mounting configuration Surface Mount for structural stability. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 44-LCC (J-Lead) that offers mechanical and thermal protection. Type of package 44-PLCC (16.58x16.58) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. The category of RF AMPS, CDMA, Cellular, GSM, NA, TDMA for frequency and modulation specifications. Classification series for the product or component HSP50016. Supplier package type 44-PLCC (16.58x16.58) for component selection.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD