Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Wireless RF Category | VSAT | |
| Circuit Topology Design | Absorptive | |
| Electrical Pathway | SP4T | |
| Operational Hz Spectrum | - | |
| Electrical Separation Rating | - | |
| Signal Insertion Attenuation | - | |
| Benchmark Hz Rate | - | |
| 1dB Compression Point | - | |
| Third-Order Intercept Point | 40dBm (typ) | |
| Key Product Highlights | - | |
| AC Resistance Value | 50Ohm | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -55°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | - | |
| Component Housing Style | Die | |
| Vendor Package Type | Die |
Description
Configured for circuit type described as SP4T. Supports 40dBm (typ) IIP3 to maintain linearity and RF performance. Configured with 50Ohm impedance to maintain signal quality. Temperature range -55°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case Die that offers mechanical and thermal protection. Type of package Die that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. The category of RF VSAT for frequency and modulation specifications. Supplier package type Die for component selection. Layout design Absorptive for electrical systems or configurations.
