Attribute
Description
Manufacturer Part Number
CYBL10562-56LQXI
Manufacturer
Description
IC RF TXRX+MCU BLE 56QFN
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 120

Quantity Unit Price Ext. Price
125 ₹ 322.87000 ₹ 40,358.75
62 ₹ 341.21000 ₹ 21,155.02
30 ₹ 367.52000 ₹ 11,025.60
10 ₹ 393.74000 ₹ 3,937.40
4 ₹ 511.86000 ₹ 2,047.44
1 ₹ 787.47000 ₹ 787.47

Stock:

Distributor: 135


Quantity Unit Price Ext. Price
10000 ₹ 378.25000 ₹ 37,82,500.00
1000 ₹ 401.39000 ₹ 4,01,390.00
500 ₹ 425.42000 ₹ 2,12,710.00
100 ₹ 448.56000 ₹ 44,856.00
25 ₹ 472.59000 ₹ 11,814.75

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
10000 ₹ 472.81000 ₹ 47,28,100.00
1000 ₹ 501.74000 ₹ 5,01,740.00
500 ₹ 531.77000 ₹ 2,65,885.00
100 ₹ 560.70000 ₹ 56,070.00
57 ₹ 590.74000 ₹ 33,672.18

Stock:

Distributor: 118


Quantity Unit Price Ext. Price
115 ₹ 696.07000 ₹ 80,048.05
27 ₹ 780.44000 ₹ 21,071.88
1 ₹ 1,265.58000 ₹ 1,265.58

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Obsolete
Device Type Classification TxRx + MCU
Radio Frequency Protocol Bluetooth
Communication Standard Bluetooth v4.1
Signal Modulation Technique GFSK
Oscillation Rate Hz 2.4GHz
Maximum Data Throughput 1Mbps
Output Wattage Rating 3dBm
Response Sensitivity Level -89dBm
Total Memory Bytes 128kB Flash, 16kB SRAM
Serial Communication Ports I2C, I2S, SPI, UART
General Purpose I/O Pins 36
Power Supply Voltage 1.9V ~ 5.5V
Receive Mode Amps 16.4mA
Transmit Mode Amps 15.6mA
Ambient Temp Range -40°C ~ 85°C
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 56-UFQFN Exposed Pad
Vendor Package Type 56-QFN (7x7)

Description

Operates with the receiving current set to 16.4mA. Features transmitting current rated at 15.6mA. Provides a maximum data rate potential of 1Mbps. Runs at a frequency of 2.4GHz. Provides 36 GPIO pins for flexible input/output interfacing. Total memory size 128kB Flash, 16kB SRAM for device storage capability. Communication modulation technique GFSK for data transmission. Mounting configuration Surface Mount for structural stability. Overall I/O 36 for digital links. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 56-UFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 56-QFN (7x7) that preserves the integrity of the device. The necessary output power 3dBm for peak device efficiency. Product status Obsolete concerning availability and lifecycle. Protocol for communication Bluetooth v4.1 for control or interaction. Type or family of RF protocol Bluetooth for communication standards. Rating for the sensitivity of sensor or input response -89dBm. Ports designated for serial communication interfaces I2C, I2S, SPI, UART. Supplier package type 56-QFN (7x7) for component selection. Voltage requirement 1.9V ~ 5.5V for electrical specifications. Type classification TxRx + MCU for specifications. Voltage supply 1.9V ~ 5.5V for device operation.