Attribute
Description
Manufacturer Part Number
CYW20741A2KFB1GT
Manufacturer
Description
IC RF BLE SGL CHIP 81FBGA
Manufacturer Lead Time
26 weeks

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tape & Reel (TR)
Availability Status Obsolete
Device Type Classification -
Radio Frequency Protocol -
Communication Standard -
Signal Modulation Technique -
Oscillation Rate Hz -
Maximum Data Throughput -
Output Wattage Rating -
Response Sensitivity Level -
Total Memory Bytes -
Serial Communication Ports -
General Purpose I/O Pins -
Power Supply Voltage -
Receive Mode Amps -
Transmit Mode Amps -
Ambient Temp Range -
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 81-TFBGA
Vendor Package Type 81-FBGA (8x8)

Description

Mounting configuration Surface Mount for structural stability. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 81-TFBGA that offers mechanical and thermal protection. Type of package 81-FBGA (8x8) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Supplier package type 81-FBGA (8x8) for component selection.