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Provides a maximum data rate potential of 1Mbps. Runs at a frequency of 6.2GHz ~ 8.3GHz. Total memory size 256kB Flash, 32kB SRAM for device storage capability. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT) for safeguarding or transporting components. Style of the enclosure/case 33-TFBGA that offers mechanical and thermal protection. Type of package 33-TFBGA (4.5x4.5) that preserves the integrity of the device. The necessary output power 11dBm for peak device efficiency. Product status Active concerning availability and lifecycle. Type or family of RF protocol General ISM > 1GHz for communication standards. Ports designated for serial communication interfaces SPI. Supplier package type 33-TFBGA (4.5x4.5) for component selection. Voltage requirement 2V ~ 3.5V for electrical specifications. Type classification TxRx + MCU for specifications. Voltage supply 2V ~ 3.5V for device operation.
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