Description

Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Operates with the receiving current set to 73mA ~ 162mA. Features transmitting current rated at 169mA ~ 359mA. Provides a maximum data rate potential of 54Mbps. Provides 62 GPIO pins for flexible input/output interfacing. Total memory size 2MB Flash, 512kB SRAM for device storage capability. Communication modulation technique CCK, DSSS, OFDM for data transmission. Mounting configuration Surface Mount for structural stability. Overall I/O 62 for digital links. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 132-VFQFN Dual Rows, Exposed Pad that offers mechanical and thermal protection. Type of package 132-VQFN (10x10) that preserves the integrity of the device. The necessary output power 21.5dBm for peak device efficiency. Product status Active concerning availability and lifecycle. Protocol for communication 802.11b/g/n for control or interaction. Type or family of RF protocol Bluetooth, WiFi for communication standards. Rating for the sensitivity of sensor or input response -100dBm. Ports designated for serial communication interfaces ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART. Classification series for the product or component PIC® 32MZ. Supplier package type 132-VQFN (10x10) for component selection. Voltage requirement 2.97V ~ 3.63V for electrical specifications. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Type classification TxRx + MCU for specifications. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Voltage supply 2.97V ~ 3.63V for device operation.