Description

Operates with the receiving current set to 5.6mA ~ 12.4mA. Features transmitting current rated at 16.7mA ~ 38.8mA. Provides a maximum data rate potential of 2Mbps. Provides 23 GPIO pins for flexible input/output interfacing. Total memory size 1MB Flash, 128kB SRAM for device storage capability. Communication modulation technique FSK for data transmission. Mounting configuration Surface Mount for structural stability. Overall I/O 23 for digital links. Temperature range -40°C ~ 125°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 32-PowerVFQFN that offers mechanical and thermal protection. Type of package 32-QFN (4x4) that preserves the integrity of the device. The necessary output power 10dBm for peak device efficiency. Product status Active concerning availability and lifecycle. Protocol for communication 802.11ax, Bluetooth v5.3, Matter, Thread, Zigbee® for control or interaction. Type or family of RF protocol 802.15.4, Bluetooth, WiFi for communication standards. Rating for the sensitivity of sensor or input response -101dBm. Ports designated for serial communication interfaces ADC, GPIO, HCI, I2C, I2S, JTAG, PWM, SDI, SPI, UART. Supplier package type 32-QFN (4x4) for component selection. Voltage requirement 1.8V ~ 3.6V for electrical specifications. Type classification TxRx + MCU for specifications. Voltage supply 1.8V ~ 3.6V for device operation.