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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Intended Uses | - | |
| User Interface Type | LPC | |
| Power Supply Voltage | - | |
| Component Housing Style | 156-VFQFN Dual Rows, Exposed Pad | |
| Vendor Package Type | 156-DQFN (12x12) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount |
Description
Designed for LPC ease of use and user interaction. Mounting configuration Surface Mount for structural stability. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 156-VFQFN Dual Rows, Exposed Pad that offers mechanical and thermal protection. Type of package 156-DQFN (12x12) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Supplier package type 156-DQFN (12x12) for component selection.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD