Stock:
Distributor: 111
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10 | ₹ 3,575.41000 | ₹ 35,754.10 |
| 3 | ₹ 4,206.62000 | ₹ 12,619.86 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Textool™ | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | SOIC | |
| Grid Pin Array Count | 24 (2 x 12) | |
| Mating Connector Pitch | - | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | - | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | 30.0µin (0.76µm) | |
| Solder Tail Material | Beryllium Copper | |
| Casing Build Material | Polyethersulfone (PES), Glass Filled | |
| Ambient Temp Range | -55°C ~ 150°C |
Description
Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Constructed with the thickness of the post finish evaluated at 30.0µin (0.76µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Beryllium Copper. Equipped with features categorized as Closed Frame. Constructed from Polyethersulfone (PES), Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 24 (2 x 12) for connector layout. Temperature range -55°C ~ 150°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component Textool™. Termination method Solder for electrical or mechanical connections. Type classification SOIC for specifications.