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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | OEM | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 40 (2 x 20) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 250.0µin (6.35µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | 250.0µin (6.35µm) | |
| Solder Tail Material | Beryllium Copper | |
| Casing Build Material | Polyether Imide (PEI), Glass Filled | |
| Ambient Temp Range | -55°C ~ 105°C |
Description
Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Emphasizes the thickness of the mating finish denoted as 250.0µin (6.35µm). Constructed with the thickness of the post finish evaluated at 250.0µin (6.35µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Beryllium Copper. Equipped with features categorized as Closed Frame. Constructed from Polyether Imide (PEI), Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 40 (2 x 20) for connector layout. Temperature range -55°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component OEM. Termination method Solder for electrical or mechanical connections. Type classification DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing for specifications.