Attribute
Description
Manufacturer Part Number
28-3554-11
Manufacturer
Description
CONN IC DIP SOCKET ZIF 24POS GLD
Manufacturer Lead Time
8 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 18 | ₹ 2,128.22000 | ₹ 38,307.96 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 2,613.04000 | ₹ 2,613.04 |
| 9 | ₹ 2,221.44000 | ₹ 19,992.96 |
| 27 | ₹ 2,120.87000 | ₹ 57,263.49 |
| 54 | ₹ 2,052.34000 | ₹ 1,10,826.36 |
| 108 | ₹ 1,983.81000 | ₹ 2,14,251.48 |
| 252 | ₹ 1,874.34000 | ₹ 4,72,333.68 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 55 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 28 (2 x 14) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | - | |
| Solder Tail Material | Beryllium Copper | |
| Casing Build Material | Polyphenylene Sulfide (PPS), Glass Filled | |
| Ambient Temp Range | -55°C ~ 250°C |
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