Attribute
Description
Manufacturer Part Number
32-6554-11
Manufacturer
Description
CONN IC DIP SOCKET ZIF 32POS GLD
Manufacturer Lead Time
8 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 117

Quantity Unit Price Ext. Price
504 ₹ 1,640.93000 ₹ 8,27,028.72
256 ₹ 1,715.05000 ₹ 4,39,052.80
104 ₹ 1,827.46000 ₹ 1,90,055.84
56 ₹ 1,909.00000 ₹ 1,06,904.00
32 ₹ 1,985.84000 ₹ 63,546.88
16 ₹ 2,085.39000 ₹ 33,366.24
1 ₹ 2,536.31000 ₹ 2,536.31

Stock:

Distributor: 121


Quantity Unit Price Ext. Price
1 ₹ 2,183.73000 ₹ 2,183.73

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 2,896.06000 ₹ 2,896.06
8 ₹ 2,461.74000 ₹ 19,693.92
24 ₹ 2,350.49000 ₹ 56,411.76
56 ₹ 2,274.84000 ₹ 1,27,391.04
104 ₹ 2,199.19000 ₹ 2,28,715.76
256 ₹ 2,077.26000 ₹ 5,31,778.56

Stock:

Distributor: 113


Quantity Unit Price Ext. Price
8 ₹ 3,088.83000 ₹ 24,710.64
16 ₹ 3,067.65000 ₹ 49,082.40
24 ₹ 3,055.19000 ₹ 73,324.56
40 ₹ 3,038.99000 ₹ 1,21,559.60
80 ₹ 3,005.35000 ₹ 2,40,428.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 55
IC Encapsulation Type Tube
Availability Status Active
Device Type Classification DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Grid Pin Array Count 32 (2 x 16)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness -
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Gold
Post Layer Depth -
Solder Tail Material Beryllium Copper
Casing Build Material Polyphenylene Sulfide (PPS), Glass Filled
Ambient Temp Range -