Attribute
Description
Manufacturer Part Number
196-PRS14001-16
Manufacturer
Description
CONN SOCKET PGA ZIF GOLD
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | PRS | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | PGA, ZIF (ZIP) | |
| Grid Pin Array Count | - | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 30.0µin (0.76µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Nickel Bronze | |
| Post Layer Depth | 50.0µin (1.27µm) | |
| Solder Tail Material | Beryllium Copper | |
| Casing Build Material | Polyphenylene Sulfide (PPS) | |
| Ambient Temp Range | -65°C ~ 200°C |
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