Attribute
Description
Manufacturer Part Number
28-6574-10
Manufacturer
Description
CONN IC DIP SOCKET ZIF 28POS TIN
Manufacturer Lead Time
--
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 111
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 7 | ₹ 1,411.90000 | ₹ 9,883.30 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 57 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 28 (2 x 14) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | 200.0µin (5.08µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Beryllium Copper | |
| Casing Build Material | Polyphenylene Sulfide (PPS), Glass Filled | |
| Ambient Temp Range | - |
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