Attribute
Description
Manufacturer Part Number
34-6823-90
Manufacturer
Description
CONN IC DIP SOCKET 34POS GOLD
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Vertisockets™ 800 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 34 (2 x 17) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 10.0µin (0.25µm) | |
| Connecting Pin Material | Phosphor Bronze | |
| Attachment Mounting Style | Through Hole, Right Angle, Horizontal | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | 10.0µin (0.25µm) | |
| Solder Tail Material | Phosphor Bronze | |
| Casing Build Material | Polyamide (PA46), Nylon 4/6 | |
| Ambient Temp Range | - |
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