Attribute
Description
Manufacturer Part Number
40-6551-10
Manufacturer
Description
CONN IC DIP SOCKET ZIF 40POS TIN
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 55
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Grid Pin Array Count 40 (2 x 20)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Tin
Engagement Layer Thickness 200.0µin (5.08µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Tin
Post Layer Depth 200.0µin (5.08µm)
Solder Tail Material Beryllium Copper
Casing Build Material Polyphenylene Sulfide (PPS), Glass Filled
Ambient Temp Range -