Attribute
Description
Manufacturer Part Number
A08-LCG
Description
CONN IC DIP SOCKET 8POS GOLD
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Obsolete
Device Type Classification DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count 8 (2 x 4)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness -
Connecting Pin Material -
Attachment Mounting Style Through Hole
Key Product Highlights Open Frame
Circuit End Method -
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Gold
Post Layer Depth -
Solder Tail Material -
Casing Build Material -
Ambient Temp Range -