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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 8180 | |
| IC Encapsulation Type | Bulk | |
| Device Type Classification | Transistor, TO-3 | |
| Grid Pin Array Count | 4 (Oval) | |
| Mating Connector Pitch | - | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Steel | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | - | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | - | |
| Solder Tail Material | Steel | |
| Casing Build Material | Polyamide (PA), Nylon, Glass Filled | |
| Ambient Temp Range | - |
Description
Offers mating contact finish rated at Tin. Provides a post-contact finish defined by Tin. Utilizes the mating contact material designated as Steel. Features the post contact material recognized as Steel. Equipped with features categorized as Closed Frame. Constructed from Polyamide (PA), Nylon, Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 4 (Oval) for connector layout. Type of housing Bulk for safeguarding or transporting components. Classification series for the product or component 8180. Termination method Solder for electrical or mechanical connections. Type classification Transistor, TO-3 for specifications.