Attribute
Description
Manufacturer Part Number
210-1-06-003
Manufacturer
Description
CONN IC DIP SOCKET 6POS GOLD
Manufacturer Lead Time
1 week
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 8000 | ₹ 21.00000 | ₹ 1,68,000.00 |
| 6000 | ₹ 21.42000 | ₹ 1,28,520.00 |
| 4000 | ₹ 27.06000 | ₹ 1,08,240.00 |
| 2000 | ₹ 43.97000 | ₹ 87,940.00 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2560 | ₹ 27.31000 | ₹ 69,913.60 |
| 1040 | ₹ 29.11000 | ₹ 30,274.40 |
| 560 | ₹ 30.41000 | ₹ 17,029.60 |
| 320 | ₹ 31.63000 | ₹ 10,121.60 |
| 160 | ₹ 33.22000 | ₹ 5,315.20 |
| 80 | ₹ 34.89000 | ₹ 2,791.20 |
| 25 | ₹ 37.88000 | ₹ 947.00 |
| 10 | ₹ 40.40000 | ₹ 404.00 |
| 1 | ₹ 47.26000 | ₹ 47.26 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 6 (2 x 3) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polybutylene Terephthalate (PBT) | |
| Ambient Temp Range | -40°C ~ 105°C |
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