Attribute
Description
Manufacturer Part Number
210-1-40-006
Manufacturer
Description
CONN IC DIP SOCKET 40POS GOLD
Manufacturer Lead Time
1 week
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1200 | ₹ 147.74000 | ₹ 1,77,288.00 |
| 900 | ₹ 151.30000 | ₹ 1,36,170.00 |
| 600 | ₹ 190.46000 | ₹ 1,14,276.00 |
| 300 | ₹ 309.72000 | ₹ 92,916.00 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 3600 | ₹ 161.23000 | ₹ 5,80,428.00 |
| 1200 | ₹ 174.21000 | ₹ 2,09,052.00 |
| 500 | ₹ 185.30000 | ₹ 92,650.00 |
| 250 | ₹ 194.59000 | ₹ 48,647.50 |
| 100 | ₹ 207.59000 | ₹ 20,759.00 |
| 50 | ₹ 218.00000 | ₹ 10,900.00 |
| 25 | ₹ 228.95000 | ₹ 5,723.75 |
| 10 | ₹ 244.28000 | ₹ 2,442.80 |
| 1 | ₹ 287.53000 | ₹ 287.53 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 40 (2 x 20) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polybutylene Terephthalate (PBT) | |
| Ambient Temp Range | -40°C ~ 105°C |
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