Attribute
Description
Manufacturer Part Number
211-1-32-006
Manufacturer
Description
CONN IC DIP SOCKET 32POS GOLD
Manufacturer Lead Time
1 week
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1500 | ₹ 104.13000 | ₹ 1,56,195.00 |
| 1125 | ₹ 105.91000 | ₹ 1,19,148.75 |
| 750 | ₹ 133.50000 | ₹ 1,00,125.00 |
| 375 | ₹ 217.16000 | ₹ 81,435.00 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 25 | ₹ 162.98000 | ₹ 4,074.50 |
| 10 | ₹ 173.92000 | ₹ 1,739.20 |
| 1 | ₹ 204.61000 | ₹ 204.61 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 32 (2 x 16) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 10.0µin (0.25µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polybutylene Terephthalate (PBT) | |
| Ambient Temp Range | -55°C ~ 105°C |
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