Attribute
Description
Manufacturer Part Number
D95008-42
Manufacturer
Description
CONN IC DIP SOCKET 8POS GOLD
Manufacturer Lead Time
20 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 110

Quantity Unit Price Ext. Price
4452 ₹ 105.02000 ₹ 4,67,549.04
3339 ₹ 107.69000 ₹ 3,59,576.91
2226 ₹ 152.19000 ₹ 3,38,774.94
1113 ₹ 288.36000 ₹ 3,20,944.68

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
4452 ₹ 114.65000 ₹ 5,10,421.80

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
4452 ₹ 114.81000 ₹ 5,11,134.12

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line D95
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count 8 (2 x 4)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 29.5µin (0.75µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Elevated, Open Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Tin
Post Layer Depth 196.9µin (5.00µm)
Solder Tail Material Brass
Casing Build Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Ambient Temp Range -55°C ~ 125°C

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Tin. Emphasizes the thickness of the mating finish denoted as 29.5µin (0.75µm). Constructed with the thickness of the post finish evaluated at 196.9µin (5.00µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Brass. Equipped with features categorized as Elevated, Open Frame. Constructed from Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 8 (2 x 4) for connector layout. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component D95. Termination method Solder for electrical or mechanical connections. Type classification DIP, 0.3" (7.62mm) Row Spacing for specifications.