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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 510 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | PGA | |
| Grid Pin Array Count | 84 (10 x 10) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | - | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | - | |
| Post Layer Depth | - | |
| Solder Tail Material | Brass Alloy | |
| Casing Build Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
| Ambient Temp Range | -55°C ~ 125°C |
Description
Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Brass Alloy. Equipped with features categorized as Open Frame. Constructed from Polycyclohexylenedimethylene Terephthalate (PCT), Polyester material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 84 (10 x 10) for connector layout. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component 510. Termination method Solder for electrical or mechanical connections. Type classification PGA for specifications.