Attribute
Description
Manufacturer Part Number
110-43-328-41-001000
Manufacturer
Description
CONN IC DIP SOCKET 28POS GOLD
Manufacturer Lead Time
6 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 346.82000 | ₹ 346.82 |
| 14 | ₹ 287.81000 | ₹ 4,029.34 |
| 28 | ₹ 274.06000 | ₹ 7,673.68 |
| 56 | ₹ 260.96000 | ₹ 14,613.76 |
| 112 | ₹ 248.48000 | ₹ 27,829.76 |
| 252 | ₹ 234.67000 | ₹ 59,136.84 |
| 504 | ₹ 223.47000 | ₹ 1,12,628.88 |
| 1008 | ₹ 212.81000 | ₹ 2,14,512.48 |
| 2506 | ₹ 199.58000 | ₹ 5,00,147.48 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 347.10000 | ₹ 347.10 |
| 10 | ₹ 288.36000 | ₹ 2,883.60 |
| 28 | ₹ 274.12000 | ₹ 7,675.36 |
| 56 | ₹ 260.77000 | ₹ 14,603.12 |
| 112 | ₹ 248.31000 | ₹ 27,810.72 |
| 252 | ₹ 227.84000 | ₹ 57,415.68 |
| 504 | ₹ 223.39000 | ₹ 1,12,588.56 |
| 1008 | ₹ 212.71000 | ₹ 2,14,411.68 |
| 2506 | ₹ 203.81000 | ₹ 5,10,747.86 |
Stock:
Distributor: 157
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 238 | ₹ 378.25000 | ₹ 90,023.50 |
| 42 | ₹ 409.40000 | ₹ 17,194.80 |
Stock:
Distributor: 130
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 569.29000 | ₹ 569.29 |
Stock:
Distributor: 121
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 647.04000 | ₹ 647.04 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 110 | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 28 (2 x 14) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 30.0µin (0.76µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass Alloy | |
| Casing Build Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
| Ambient Temp Range | -55°C ~ 125°C |
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