Attribute
Description
Manufacturer Part Number
110-44-424-41-001000
Manufacturer
Description
CONN IC DIP SOCKET 24POS TIN
Manufacturer Lead Time
6 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2512 | ₹ 91.05000 | ₹ 2,28,717.60 |
| 1008 | ₹ 97.11000 | ₹ 97,886.88 |
| 512 | ₹ 101.86000 | ₹ 52,152.32 |
| 256 | ₹ 106.97000 | ₹ 27,384.32 |
| 112 | ₹ 113.40000 | ₹ 12,700.80 |
| 64 | ₹ 117.97000 | ₹ 7,550.08 |
| 32 | ₹ 123.91000 | ₹ 3,965.12 |
| 16 | ₹ 130.15000 | ₹ 2,082.40 |
| 1 | ₹ 158.74000 | ₹ 158.74 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 307.05000 | ₹ 307.05 |
| 25 | ₹ 306.16000 | ₹ 7,654.00 |
| 48 | ₹ 294.59000 | ₹ 14,140.32 |
| 112 | ₹ 283.02000 | ₹ 31,698.24 |
| 256 | ₹ 167.32000 | ₹ 42,833.92 |
| 512 | ₹ 151.30000 | ₹ 77,465.60 |
Stock:
Distributor: 123
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 50 | ₹ 554.47000 | ₹ 27,723.50 |
| 250 | ₹ 313.28000 | ₹ 78,320.00 |
| 500 | ₹ 253.65000 | ₹ 1,26,825.00 |
| 1000 | ₹ 216.27000 | ₹ 2,16,270.00 |
| 2500 | ₹ 194.91000 | ₹ 4,87,275.00 |
| 5000 | ₹ 183.34000 | ₹ 9,16,700.00 |
| 10000 | ₹ 174.44000 | ₹ 17,44,400.00 |
Stock:
Distributor: 114
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 50 | ₹ 890.00000 | ₹ 44,500.00 |
| 100 | ₹ 445.00000 | ₹ 44,500.00 |
| 250 | ₹ 217.16000 | ₹ 54,290.00 |
| 500 | ₹ 169.10000 | ₹ 84,550.00 |
| 1000 | ₹ 137.95000 | ₹ 1,37,950.00 |
| 2500 | ₹ 114.81000 | ₹ 2,87,025.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 110 | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.4" (10.16mm) Row Spacing | |
| Grid Pin Array Count | 24 (2 x 12) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | 100.0µin (2.54µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass Alloy | |
| Casing Build Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
| Ambient Temp Range | -55°C ~ 125°C |
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