Attribute
Description
Manufacturer Part Number
110-44-632-41-001000
Manufacturer
Description
CONN IC DIP SOCKET 32POS TIN
Manufacturer Lead Time
6 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 122
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 30000 | ₹ 112.59000 | ₹ 33,77,700.00 |
| 15000 | ₹ 114.36000 | ₹ 17,15,400.00 |
| 12000 | ₹ 119.01000 | ₹ 14,28,120.00 |
| 9000 | ₹ 123.64000 | ₹ 11,12,760.00 |
| 6000 | ₹ 131.13000 | ₹ 7,86,780.00 |
| 3000 | ₹ 139.89000 | ₹ 4,19,670.00 |
| 48 | ₹ 160.71000 | ₹ 7,714.08 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2508 | ₹ 119.94000 | ₹ 3,00,809.52 |
| 1008 | ₹ 127.90000 | ₹ 1,28,923.20 |
| 504 | ₹ 134.31000 | ₹ 67,692.24 |
| 252 | ₹ 141.05000 | ₹ 35,544.60 |
| 108 | ₹ 149.74000 | ₹ 16,171.92 |
| 60 | ₹ 156.08000 | ₹ 9,364.80 |
| 36 | ₹ 161.84000 | ₹ 5,826.24 |
| 12 | ₹ 174.87000 | ₹ 2,098.44 |
| 1 | ₹ 208.54000 | ₹ 208.54 |
Stock:
Distributor: 111
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 12 | ₹ 189.13000 | ₹ 2,269.56 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 205.59000 | ₹ 205.59 |
| 12 | ₹ 171.77000 | ₹ 2,061.24 |
| 24 | ₹ 159.31000 | ₹ 3,823.44 |
| 60 | ₹ 153.08000 | ₹ 9,184.80 |
| 108 | ₹ 146.85000 | ₹ 15,859.80 |
| 252 | ₹ 138.84000 | ₹ 34,987.68 |
| 504 | ₹ 131.72000 | ₹ 66,386.88 |
| 1008 | ₹ 125.49000 | ₹ 1,26,493.92 |
| 2508 | ₹ 117.48000 | ₹ 2,94,639.84 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 110 | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 32 (2 x 16) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | 100.0µin (2.54µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass Alloy | |
| Casing Build Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
| Ambient Temp Range | -55°C ~ 125°C |
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