Attribute
Description
Manufacturer Part Number
210-43-628-41-001000
Manufacturer
Description
CONN IC DIP SOCKET 28POS GOLD
Manufacturer Lead Time
6 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2506 | ₹ 202.11000 | ₹ 5,06,487.66 |
| 1008 | ₹ 215.51000 | ₹ 2,17,234.08 |
| 504 | ₹ 226.30000 | ₹ 1,14,055.20 |
| 252 | ₹ 237.64000 | ₹ 59,885.28 |
| 112 | ₹ 251.64000 | ₹ 28,183.68 |
| 56 | ₹ 264.26000 | ₹ 14,798.56 |
| 28 | ₹ 277.51000 | ₹ 7,770.28 |
| 14 | ₹ 291.43000 | ₹ 4,080.02 |
| 1 | ₹ 351.38000 | ₹ 351.38 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 350.66000 | ₹ 350.66 |
| 10 | ₹ 291.03000 | ₹ 2,910.30 |
| 28 | ₹ 276.79000 | ₹ 7,750.12 |
| 56 | ₹ 263.44000 | ₹ 14,752.64 |
| 112 | ₹ 250.98000 | ₹ 28,109.76 |
| 252 | ₹ 236.74000 | ₹ 59,658.48 |
| 504 | ₹ 225.17000 | ₹ 1,13,485.68 |
| 1008 | ₹ 214.49000 | ₹ 2,16,205.92 |
| 2506 | ₹ 201.14000 | ₹ 5,04,056.84 |
Stock:
Distributor: 113
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 56 | ₹ 756.32000 | ₹ 42,353.92 |
| 42 | ₹ 750.09000 | ₹ 31,503.78 |
| 70 | ₹ 746.35000 | ₹ 52,244.50 |
| 140 | ₹ 742.62000 | ₹ 1,03,966.80 |
| 280 | ₹ 736.39000 | ₹ 2,06,189.20 |
Stock:
Distributor: 114
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 50 | ₹ 890.00000 | ₹ 44,500.00 |
| 100 | ₹ 587.40000 | ₹ 58,740.00 |
| 250 | ₹ 420.97000 | ₹ 1,05,242.50 |
| 500 | ₹ 356.00000 | ₹ 1,78,000.00 |
| 1000 | ₹ 305.27000 | ₹ 3,05,270.00 |
| 2500 | ₹ 265.22000 | ₹ 6,63,050.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 210 | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 28 (2 x 14) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 30.0µin (0.76µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass Alloy | |
| Casing Build Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
| Ambient Temp Range | -55°C ~ 125°C |
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