Attribute
Description
Manufacturer Part Number
0050395288
Manufacturer
Description
CONN IC DIP SOCKET 28POS TINLEAD
Manufacturer Lead Time
1 week

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type -
Availability Status Obsolete
Device Type Classification DIP, 0.6" (15.24mm) Row Spacing
Grid Pin Array Count 28 (2 x 14)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Tin-Lead
Engagement Layer Thickness -
Connecting Pin Material -
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method -
Post Pin Interval -
Post-Contact Pin Layer -
Post Layer Depth -
Solder Tail Material -
Casing Build Material -
Ambient Temp Range -

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Tin-Lead. Equipped with features categorized as Closed Frame. Mounting configuration Through Hole for structural stability. Pins or positions on grid 28 (2 x 14) for connector layout. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. Product status Obsolete concerning availability and lifecycle. Type classification DIP, 0.6" (15.24mm) Row Spacing for specifications.