Attribute
Description
Manufacturer Part Number
508-AG10D
Description
CONN IC DIP SOCKET 8POS GOLD
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 500
IC Encapsulation Type Bulk
Availability Status Obsolete
Device Type Classification DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count 8 (2 x 4)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 25.0µin (0.63µm)
Connecting Pin Material Copper Alloy
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Gold
Post Layer Depth 25.0µin (0.63µm)
Solder Tail Material Copper Alloy
Casing Build Material -
Ambient Temp Range -55°C ~ 125°C

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Emphasizes the thickness of the mating finish denoted as 25.0µin (0.63µm). Constructed with the thickness of the post finish evaluated at 25.0µin (0.63µm). Utilizes the mating contact material designated as Copper Alloy. Features the post contact material recognized as Copper Alloy. Equipped with features categorized as Closed Frame. Mounting configuration Through Hole for structural stability. Pins or positions on grid 8 (2 x 4) for connector layout. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component 500. Termination method Solder for electrical or mechanical connections. Type classification DIP, 0.3" (7.62mm) Row Spacing for specifications.