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Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

3M INTERCONNECT

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
img
256-5205-01 3M INTERCONNECT
3M INTERCONNECT
₹9,024.60
Textool™
Bulk
Active
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
img
234-3034-01-0602 3M INTERCONNECT
3M INTERCONNECT
₹6,277.18
Textool™
Bulk
Active
Zig-Zag, ZIF (ZIP)
34 (1 x 34)
0.050" (1.27mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
232-5205-01 3M INTERCONNECT
3M INTERCONNECT
₹7,476.00
Textool™
Bulk
Active
QFN
32 (4 x 8)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
img
248-5205-00 3M INTERCONNECT
3M INTERCONNECT
₹6,876.14
Textool™
Bulk
Active
QFN
48 (4 x 12)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
img
264-4493-00-0602J 3M INTERCONNECT
3M INTERCONNECT
₹3,818.10
Textool™
Tube
Active
DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
288-4205-01 3M INTERCONNECT
3M INTERCONNECT
₹12,039.92
Textool™
Bulk
Active
QFN
88 (4 x 22)
0.016" (0.40mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.016" (0.40mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
img
224-1275-00-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,460.88
Textool™
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
224-5205-01 3M INTERCONNECT
3M INTERCONNECT
₹6,961.58
Textool™
Bulk
Active
QFN
24 (4x4)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
img
220-2600-00-0602 3M INTERCONNECT
3M INTERCONNECT
₹3,355.16
Textool™
Bulk
Active
SIP, ZIF (ZIP)
20 (1 x 20)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
264-5205-01 3M INTERCONNECT
3M INTERCONNECT
₹9,599.58
Textool™
BulkBulk
Active
QFN
64 (4 x 16)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.020" (0.50mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
img
224-1286-00-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,943.37
Textool™
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
224-5809-00-0602 3M INTERCONNECT
3M INTERCONNECT
₹3,460.11
Textool™
Bulk
Active
SIP, ZIF (ZIP)
24 (1 x 24)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
248-5205-01 3M INTERCONNECT
3M INTERCONNECT
₹8,557.49
Textool™
Bulk
Active
QFN
48 (4 x 12)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
img
240-5205-00 3M INTERCONNECT
3M INTERCONNECT
₹6,410.67
Textool™
Bulk
Active
QFN
40 (4 x 10)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
img
203-2737-55-1102 3M INTERCONNECT
3M INTERCONNECT
₹2,471.35
Textool™
Bulk
Active
Transistor, TO-3 and TO-66
3 (Rectangular)
-
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.234" (5.94mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 150°C
img
236-6225-00-0602 3M INTERCONNECT
3M INTERCONNECT
₹3,889.30
Textool™
Bulk
Active
SIP, ZIF (ZIP)
36 (1 x 36)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
224-5248-00-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,989.78
Textool™
Bulk
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
240-1280-00-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,882.31
Textool™
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
214-3339-00-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,336.78
Textool™
Tube
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
img
216-3340-00-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,432.01
Textool™
Tube
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD