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4 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

AMPHENOL ANYTEK

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
AMPHENOL ANYTEK
₹21.21
SU
Bulk
Active
SIP
10
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
AMPHENOL ANYTEK
₹38.88
*
Bulk
Active
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
AMPHENOL ANYTEK
₹35.69
SU
Bulk
Active
DIP, 0.1" (2.54mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Polyphenylene Sulfide (PPS)
-40°C ~ 105°C
AMPHENOL ANYTEK
₹63.81
SU
Bulk
Active
DIP, 0.1" (2.54mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-40°C ~ 105°C