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11 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

AMPHENOL FCI

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
AMPHENOL FCI
₹168.45
-
Bag
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
AMPHENOL FCI
₹123.49
-
Bag
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
AMPHENOL FCI
₹88.11
SIP1x
Bulk
Active
SIP
12 (1 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
AMPHENOL FCI
₹534.00
-
Tube
Obsolete
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-55°C ~ 125°C
AMPHENOL FCI
₹640.80
-
Tube
Obsolete
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
100.0µin (2.54µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-40°C ~ 105°C
AMPHENOL FCI
₹159.39
-
Bag
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
AMPHENOL FCI
₹320.40
-
Bulk
Active
PGA
132 (14 x 14)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
AMPHENOL FCI
₹655.93
-
Bulk
Active
PGA
168 (17 x 17)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
AMPHENOL FCI
₹1,424.00
-
Bulk
Active
PGA
179 (18 x 18)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
AMPHENOL FCI
₹357.78
-
Bulk
Active
PGA
179 (18 x 18)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
AMPHENOL FCI
₹404.95
-
Bulk
Active
PGA
145 (15 x 15)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-