Attribute
Description
Manufacturer Part Number
A-WBP-B002EA-03SR01
Description
WIRE-TO-BOARD, WAFER, 1.00MM, 3P
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line A-WBP
IC Encapsulation Type Tape & Reel (TR)
Availability Status Obsolete
Interface Connector Category Header
Pin Interface Category Outer Shroud Contact
Mating Connector Pitch 0.039" (1.00mm)
Switch Position Options 3
Grid Row Count 1
Mating Row Interval -
Populated Position Count All
Design Style Variant Board to Board
Connector Shroud Coverage Shrouded - 4 Wall
Attachment Mounting Style Surface Mount, Right Angle
Circuit End Method Solder
Secure Attachment Method Push-Pull
Engagement Pin Length -
Tail Pin Extension -
Full Pin Contact Span -
Barrier Wall Height 0.115" (2.92mm)
Pin Profile Design Rectangular
Engaging Pin Coating Tin
Engagement Layer Thickness -
Post-Contact Pin Layer Tin
Pin Alloy Composition Brass
Dielectric Insulation Type Polyamide (PA9T), Nylon 9T
Key Product Highlights Solder Retention
Ambient Temp Range -40°C ~ 105°C
Dust Water Resistance Rating -
Fire Resistance Classification UL94 V-0
Covering Wire Hue Ivory
Ampere Capacity Rating 1A
Max Voltage Specification 50VAC/DC