Attribute
Description
Manufacturer Part Number
18-8400-610C
Manufacturer
Description
CONN IC DIP SOCKET 18POS GOLD
Manufacturer Lead Time
8 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1000 | ₹ 785.87000 | ₹ 7,85,870.00 |
| 500 | ₹ 797.44000 | ₹ 3,98,720.00 |
| 250 | ₹ 819.69000 | ₹ 2,04,922.50 |
| 100 | ₹ 866.86000 | ₹ 86,686.00 |
| 50 | ₹ 892.67000 | ₹ 44,633.50 |
| 25 | ₹ 934.50000 | ₹ 23,362.50 |
| 5 | ₹ 1,031.51000 | ₹ 5,157.55 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 33 | ₹ 1,094.39000 | ₹ 36,114.87 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 1,140.98000 | ₹ 1,140.98 |
| 10 | ₹ 1,060.88000 | ₹ 10,608.80 |
| 25 | ₹ 852.62000 | ₹ 21,315.50 |
| 250 | ₹ 815.24000 | ₹ 2,03,810.00 |
| 500 | ₹ 787.65000 | ₹ 3,93,825.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 8 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 18 (2 x 9) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 30.0µin (0.76µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame, Elevated | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | 10.0µin (0.25µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
| Ambient Temp Range | -55°C ~ 105°C |
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