Attribute
Description
Manufacturer Part Number
18-8750-310C
Manufacturer
Description
CONN IC DIP SOCKET 18POS GOLD
Manufacturer Lead Time
8 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1000 | ₹ 769.85000 | ₹ 7,69,850.00 |
| 500 | ₹ 781.42000 | ₹ 3,90,710.00 |
| 250 | ₹ 802.78000 | ₹ 2,00,695.00 |
| 100 | ₹ 849.95000 | ₹ 84,995.00 |
| 50 | ₹ 874.87000 | ₹ 43,743.50 |
| 25 | ₹ 915.81000 | ₹ 22,895.25 |
| 5 | ₹ 1,011.04000 | ₹ 5,055.20 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 1,070.67000 | ₹ 1,070.67 |
| 10 | ₹ 1,027.06000 | ₹ 10,270.60 |
| 25 | ₹ 941.62000 | ₹ 23,540.50 |
| 50 | ₹ 929.16000 | ₹ 46,458.00 |
| 100 | ₹ 921.15000 | ₹ 92,115.00 |
| 250 | ₹ 894.45000 | ₹ 2,23,612.50 |
| 500 | ₹ 879.32000 | ₹ 4,39,660.00 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 34 | ₹ 1,073.90000 | ₹ 36,512.60 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 8 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 18 (2 x 9) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 30.0µin (0.76µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame, Elevated | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | 10.0µin (0.25µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
| Ambient Temp Range | -55°C ~ 105°C |
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