Attribute
Description
Manufacturer Part Number
24-4518-10
Manufacturer
Description
CONN IC DIP SOCKET 24POS GOLD
Manufacturer Lead Time
8 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 7500 | ₹ 178.00000 | ₹ 13,35,000.00 |
| 5000 | ₹ 180.67000 | ₹ 9,03,350.00 |
| 2500 | ₹ 185.12000 | ₹ 4,62,800.00 |
| 1000 | ₹ 190.46000 | ₹ 1,90,460.00 |
| 500 | ₹ 198.47000 | ₹ 99,235.00 |
| 250 | ₹ 207.37000 | ₹ 51,842.50 |
| 100 | ₹ 217.16000 | ₹ 21,716.00 |
| 10 | ₹ 267.00000 | ₹ 2,670.00 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2500 | ₹ 187.11000 | ₹ 4,67,775.00 |
| 1000 | ₹ 199.59000 | ₹ 1,99,590.00 |
| 500 | ₹ 209.59000 | ₹ 1,04,795.00 |
| 250 | ₹ 220.09000 | ₹ 55,022.50 |
| 100 | ₹ 234.79000 | ₹ 23,479.00 |
| 50 | ₹ 246.58000 | ₹ 12,329.00 |
| 25 | ₹ 258.94000 | ₹ 6,473.50 |
| 10 | ₹ 276.31000 | ₹ 2,763.10 |
| 1 | ₹ 325.59000 | ₹ 325.59 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 297.26000 | ₹ 297.26 |
| 10 | ₹ 251.87000 | ₹ 2,518.70 |
| 25 | ₹ 236.74000 | ₹ 5,918.50 |
| 50 | ₹ 225.17000 | ₹ 11,258.50 |
| 100 | ₹ 214.49000 | ₹ 21,449.00 |
| 250 | ₹ 201.14000 | ₹ 50,285.00 |
| 500 | ₹ 193.13000 | ₹ 96,565.00 |
| 1000 | ₹ 184.23000 | ₹ 1,84,230.00 |
| 2500 | ₹ 175.33000 | ₹ 4,38,325.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 518 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.4" (10.16mm) Row Spacing | |
| Grid Pin Array Count | 24 (2 x 12) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 10.0µin (0.25µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
| Ambient Temp Range | - |
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