Attribute
Description
Manufacturer Part Number
24-516-11
Manufacturer
Description
CONN IC DIP SOCKET ZIF 24POS GLD
Manufacturer Lead Time
8 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1005 | ₹ 875.76000 | ₹ 8,80,138.80 |
| 510 | ₹ 903.35000 | ₹ 4,60,708.50 |
| 255 | ₹ 930.94000 | ₹ 2,37,389.70 |
| 105 | ₹ 966.54000 | ₹ 1,01,486.70 |
| 60 | ₹ 988.79000 | ₹ 59,327.40 |
| 30 | ₹ 1,017.27000 | ₹ 30,518.10 |
| 15 | ₹ 1,044.86000 | ₹ 15,672.90 |
Stock:
Distributor: 115
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1005 | ₹ 875.76000 | ₹ 8,80,138.80 |
| 510 | ₹ 903.35000 | ₹ 4,60,708.50 |
| 255 | ₹ 930.94000 | ₹ 2,37,389.70 |
| 105 | ₹ 966.54000 | ₹ 1,01,486.70 |
| 60 | ₹ 988.79000 | ₹ 59,327.40 |
| 30 | ₹ 1,017.27000 | ₹ 30,518.10 |
| 15 | ₹ 1,044.86000 | ₹ 15,672.90 |
Stock:
Distributor: 111
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 30 | ₹ 1,173.32000 | ₹ 35,199.60 |
| 15 | ₹ 1,224.92000 | ₹ 18,373.80 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 30 | ₹ 1,294.17000 | ₹ 38,825.10 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 1,343.01000 | ₹ 1,343.01 |
| 10 | ₹ 1,318.09000 | ₹ 13,180.90 |
| 60 | ₹ 1,035.07000 | ₹ 62,104.20 |
| 105 | ₹ 1,015.49000 | ₹ 1,06,626.45 |
| 255 | ₹ 997.69000 | ₹ 2,54,410.95 |
| 510 | ₹ 983.45000 | ₹ 5,01,559.50 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 516 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, ZIF (ZIP) | |
| Grid Pin Array Count | 24 (2 x 12) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 10.0µin (0.25µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | 10.0µin (0.25µm) | |
| Solder Tail Material | Beryllium Copper | |
| Casing Build Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
| Ambient Temp Range | - |
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