Attribute
Description
Manufacturer Part Number
44-547-11
Manufacturer
Description
CONN SOCKET SOIC ZIF 44POS GOLD
Manufacturer Lead Time
8 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10 | ₹ 20,429.06000 | ₹ 2,04,290.60 |
| 5 | ₹ 20,740.56000 | ₹ 1,03,702.80 |
| 3 | ₹ 21,056.51000 | ₹ 63,169.53 |
| 1 | ₹ 21,658.15000 | ₹ 21,658.15 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 25 | ₹ 21,736.27000 | ₹ 5,43,406.75 |
| 10 | ₹ 22,882.38000 | ₹ 2,28,823.80 |
| 1 | ₹ 26,915.73000 | ₹ 26,915.73 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 547 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | SOIC, ZIF (ZIP) | |
| Grid Pin Array Count | 44 (2 x 22) | |
| Mating Connector Pitch | - | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 20.0µin (0.51µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.050" (1.27mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | 20.0µin (0.51µm) | |
| Solder Tail Material | Beryllium Copper | |
| Casing Build Material | Polyphenylene Sulfide (PPS), Glass Filled | |
| Ambient Temp Range | - |
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