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Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Source Adapter Interface0

Target Adapter Interface0

IC Pin Total0

Mating Connector Pitch0

Engaging Pin Coating0

Attachment Mounting Style0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Casing Build Material0

Circuit Board Substrate0

Manufacturer

LOGICAL SYSTEMS

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Source Adapter Interface
Target Adapter Interface
IC Pin Total
Mating Connector Pitch
Engaging Pin Coating
Attachment Mounting Style
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Casing Build Material
Circuit Board Substrate
img
PA-SOD6SM18-40 LOGICAL SYSTEMS
LOGICAL SYSTEMS
₹1,779.20
-
Bulk
Active
SOIC
DIP, 0.6" (15.24mm) Row Spacing
40
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
img
PA-TS1D6SM18-40 LOGICAL SYSTEMS
LOGICAL SYSTEMS
₹1,779.20
-
Bulk
Active
TSOP
DIP
40
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
img
PA-SOD6SM18-44 LOGICAL SYSTEMS
LOGICAL SYSTEMS
₹1,957.12
-
Bulk
Active
SOIC
DIP
44
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
img
PA-TS1D6SM18-56 LOGICAL SYSTEMS
LOGICAL SYSTEMS
₹2,490.88
-
Bulk
Active
TSOP
DIP
56
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD