Attribute
Description
Manufacturer Part Number
90233-AS
Manufacturer
Description
CONTACT SPRING LOADED SMD GOLD
Manufacturer Lead Time
1 week

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Pin Interface Category Sleeve & Plunger (Pogo Pins)
Attachment Mounting Style Surface Mount
Top Operational Elevation 0.236" (6.00mm)
Optimal Use Elevation -
Lowest Operational Elevation 0.165" (4.20mm)
Solder Pad Size Circular - 0.110" (2.80mm)
Starting Actuation Force 20.39gf
Mid-Stroke Force 40.79gf
Actuator Plunger Dimension 0.042" (1.07mm) Dia
Key Product Highlights -
Connection Durability Cycles 40000
Pin Alloy Composition Brass Alloy
Pin Surface Treatment Gold
Pin Coating Depth 30.0µin (0.76µm)
Ampere Capacity Rating 2A

Description

Includes contact finish plated at Gold to improve conductivity. Represents the thickness of the contact finish recorded at 30.0µin (0.76µm). Constructed from the contact material known as Brass Alloy. Makes use of a contact type known as Sleeve & Plunger (Pogo Pins). Facilitates a maximum output current level set as 0.165" (4.20mm). Sets the ampere rating to 2A. Supports 40000 mating cycles to ensure enduring reliability. Maximum operational height 0.236" (6.00mm) for safe performance. Minimum working altitude 0.165" (4.20mm) for safety and comfort. Mounting configuration Surface Mount for structural stability. Initial force 20.39gf required for accurate actuation. Force exerted during mid-stroke 40.79gf for dependable performance. Type of housing Bulk for safeguarding or transporting components. Dimensions of the pad Circular - 0.110" (2.80mm) for PCB design. The 0.042" (1.07mm) Dia size of the plunger for mechanical functionality. Product status Active concerning availability and lifecycle.