Attribute
Description
Manufacturer Part Number
MIKROE-302
Manufacturer
Description
SOIC-SOP-8 TO DIP8-300MIL ADAPTE
Manufacturer Lead Time
5 weeks

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Obsolete
Prototype Board Style SMD to DIP
Supported Package Formats SOIC, SOP
Switch Position Options 8
Component Spacing Distance -
Circuit Board Depth -
Construction Material Type FR4 Epoxy Glass
Package Size Specs -

Description

Type of construction material FR4 Epoxy Glass for durability and efficiency. Overall number of positions 8 for switches or mechanical components. Type of housing Bulk for safeguarding or transporting components. Accepted package formats SOIC, SOP for manufacturing or assembly. Product status Obsolete concerning availability and lifecycle. Design of prototype board SMD to DIP for development tasks.