Attribute
Description
Manufacturer Part Number
MIKROE-308
Manufacturer
Description
TSSOP-SSOP-24 TO DIP24-300MIL AD
Manufacturer Lead Time
5 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 130

Quantity Unit Price Ext. Price
1 ₹ 482.11000 ₹ 482.11
5 ₹ 472.47000 ₹ 2,362.35

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Box
Availability Status Active
Prototype Board Style SMD to DIP
Supported Package Formats SSOP, TSSOP
Switch Position Options 24
Component Spacing Distance 0.026" (0.65mm)
Circuit Board Depth -
Construction Material Type FR4 Epoxy Glass
Package Size Specs -

Description

Type of construction material FR4 Epoxy Glass for durability and efficiency. Overall number of positions 24 for switches or mechanical components. Type of housing Box for safeguarding or transporting components. Accepted package formats SSOP, TSSOP for manufacturing or assembly. Distance 0.026" (0.65mm) for arranging components or aligning connectors. Product status Active concerning availability and lifecycle. Design of prototype board SMD to DIP for development tasks.