Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Prototype Board Style | Plated Through Hole to Plated Through Hole | |
| Supported Package Formats | microSD™ Card | |
| Switch Position Options | 11 | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Circuit Board Depth | 0.120" (3.05mm) | |
| Construction Material Type | - | |
| Package Size Specs | 0.800" L x 0.700" W (20.32mm x 17.78mm) |
Description
Features a thickness of 0.120" (3.05mm) to ensure strong structural integrity. Overall number of positions 11 for switches or mechanical components. Type of housing Bulk for safeguarding or transporting components. Accepted package formats microSD™ Card for manufacturing or assembly. Distance 0.100" (2.54mm) for arranging components or aligning connectors. Product status Active concerning availability and lifecycle. Design of prototype board Plated Through Hole to Plated Through Hole for development tasks. Details on package size 0.800" L x 0.700" W (20.32mm x 17.78mm) for electrical or mechanical components. Measurement dimensions 0.800" L x 0.700" W (20.32mm x 17.78mm) for component specifications.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD