Attribute
Description
Manufacturer Part Number
14-24-LOGIC-EVM
Manufacturer
Description
DEVELOPMENT SPECIALIZED
Manufacturer Lead Time
53 weeks
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Prototype Board Style | SMD to Plated Through Hole | |
| Supported Package Formats | SOIC, TSSOP | |
| Switch Position Options | - | |
| Component Spacing Distance | - | |
| Circuit Board Depth | - | |
| Construction Material Type | - | |
| Package Size Specs | - |
Description
Type of housing Box for safeguarding or transporting components. Accepted package formats SOIC, TSSOP for manufacturing or assembly. Product status Active concerning availability and lifecycle. Design of prototype board SMD to Plated Through Hole for development tasks.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD