Stock:
Distributor: 11
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1000 | ₹ 253.65000 | ₹ 2,53,650.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bag | |
| Availability Status | Obsolete | |
| Device Type Classification | Board Level | |
| Thermal Package Design | TO-5 | |
| Mounting Technique | Press Fit | |
| Physical Shape Form | Cylindrical | |
| Linear Length Dimension | - | |
| Horizontal Width Dimension | - | |
| Circular Measurement | 0.305" (7.75mm) ID, 0.500" (12.70mm) OD | |
| Heat Sink Fin Elevation | 0.250" (6.35mm) | |
| Power at Temp Increase | 0.6W @ 40°C | |
| Thermal Resistance with Fan | 35.00°C/W @ 200 LFM | |
| Passive Cooling Resistance | 63.00°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Fastened using a Press Fit method for dependable placement. Offers diameter noted at 0.305" (7.75mm) ID, 0.500" (12.70mm) OD. Records the fin height at 0.250" (6.35mm). Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Bag for safeguarding or transporting components. Layout of the thermal management package TO-5 aimed at cooling. Power dissipation at increased temperature 0.6W @ 40°C for device longevity. Product status Obsolete concerning availability and lifecycle. Shape Cylindrical for the part or device. Thermal resistance with fan assistance 35.00°C/W @ 200 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 63.00°C/W for heat regulation. Type classification Board Level for specifications.
