Stock:
Distributor: 122
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1080 | ₹ 343.68000 | ₹ 3,71,174.40 |
| 216 | ₹ 345.85000 | ₹ 74,703.60 |
Stock:
Distributor: 11
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 742.26000 | ₹ 742.26 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Board Level | |
| Thermal Package Design | BGA | |
| Mounting Technique | Solder Anchor | |
| Physical Shape Form | Square, Pin Fins | |
| Linear Length Dimension | 1.575" (40.00mm) | |
| Horizontal Width Dimension | 1.575" (40.01mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.709" (18.00mm) | |
| Power at Temp Increase | 2.0W @ 30°C | |
| Thermal Resistance with Fan | 4.30°C/W @ 200 LFM | |
| Passive Cooling Resistance | 12.00°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Fastened using a Solder Anchor method for dependable placement. Records the fin height at 0.709" (18.00mm). Overall length 1.575" (40.00mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package BGA aimed at cooling. Power dissipation at increased temperature 2.0W @ 30°C for device longevity. Product status Active concerning availability and lifecycle. Shape Square, Pin Fins for the part or device. Thermal resistance with fan assistance 4.30°C/W @ 200 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 12.00°C/W for heat regulation. Type classification Board Level for specifications. Horizontal width measurement 1.575" (40.01mm).
