Attribute
Description
Manufacturer Part Number
533702B02552G
Manufacturer
Description
BOARD LEVEL HEAT SINK
Manufacturer Lead Time
1 week
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Stock:

Distributor: 121

Quantity Unit Price Ext. Price
1 ₹ 970.45000 ₹ 970.45

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Board Level, Vertical
Thermal Package Design TO-220
Mounting Technique Clip and PC Pin
Physical Shape Form Rectangular, Fins
Linear Length Dimension 1.000" (25.40mm)
Horizontal Width Dimension 1.650" (41.91mm)
Circular Measurement -
Heat Sink Fin Elevation 1.000" (25.40mm)
Power at Temp Increase 12.0W @ 70°C
Thermal Resistance with Fan 4.00°C/W @ 200 LFM
Passive Cooling Resistance 5.70°C/W
Construction Material Type Aluminum
Surface Material Treatment Black Anodized

Description

Fastened using a Clip and PC Pin method for dependable placement. Records the fin height at 1.000" (25.40mm). Overall length 1.000" (25.40mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package TO-220 aimed at cooling. Power dissipation at increased temperature 12.0W @ 70°C for device longevity. Product status Active concerning availability and lifecycle. Shape Rectangular, Fins for the part or device. Thermal resistance with fan assistance 4.00°C/W @ 200 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 5.70°C/W for heat regulation. Type classification Board Level, Vertical for specifications. Horizontal width measurement 1.650" (41.91mm).