Attribute
Description
Manufacturer Part Number
2227B
Manufacturer
Description
BOARD LEVEL HEAT SINK
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Board Level | |
| Thermal Package Design | TO-5 | |
| Mounting Technique | Press Fit | |
| Physical Shape Form | Cylindrical | |
| Linear Length Dimension | - | |
| Horizontal Width Dimension | - | |
| Circular Measurement | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD | |
| Heat Sink Fin Elevation | 0.400" (10.16mm) | |
| Power at Temp Increase | 1.8W @ 50°C | |
| Thermal Resistance with Fan | 14.00°C/W @ 200 LFM | |
| Passive Cooling Resistance | 21.00°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
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