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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Box | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | Raspberry Pi | |
| Mounting Technique | Bolt On | |
| Physical Shape Form | Rectangular, Fins | |
| Linear Length Dimension | 2.700" (68.58mm) | |
| Horizontal Width Dimension | 1.100" (27.94mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.300" (7.62mm) | |
| Power at Temp Increase | 2.0W @ 40°C | |
| Thermal Resistance with Fan | 6.90°C/W @ 300 LFM | |
| Passive Cooling Resistance | 20.20°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Silver |
Description
Fastened using a Bolt On method for dependable placement. Records the fin height at 0.300" (7.62mm). Overall length 2.700" (68.58mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Silver for safeguarding and aesthetic enhancement. Type of housing Box for safeguarding or transporting components. Layout of the thermal management package Raspberry Pi aimed at cooling. Power dissipation at increased temperature 2.0W @ 40°C for device longevity. Shape Rectangular, Fins for the part or device. Thermal resistance with fan assistance 6.90°C/W @ 300 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 20.20°C/W for heat regulation. Type classification Top Mount for specifications. Horizontal width measurement 1.100" (27.94mm).
